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1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
Journal of Lightwave Technology ( IF 4.1 ) Pub Date : 2020-11-20 , DOI: 10.1109/jlt.2020.3039218
Saeed Fathololoumi , David Hui , Susheel Jadhav , Jian Chen , Kimchau Nguyen , M.N. Sakib , Z. Li , Hari Mahalingam , Siamak Amiralizadeh , Nelson N. Tang , Harinadh Potluri , Mohammad Montazeri , Harel Frish , Reece A. Defrees , Christopher Seibert , Alexander Krichevsky , Jonathan K. Doylend , John Heck , R. Venables , A. Dahal , A. Awujoola , A. Vardapetyan , Guneet Kaur , Min Cen , Vishnu Kulkarni , Syed S. Islam , R. L. Spreitzer , S. Garag , A. C. Alduino , RK Chiou , L. Kamyab , S. Gupta , B. Xie , R. S. Appleton , S. Hollingsworth , S. McCargar , Y. Akulova , K. M. Brown , R. Jones , Daniel Zhu , Thomas Liljeberg , Ling Liao

We describe the performance of high bandwidth-density silicon photonic based integrated circuits (SiPh ICs) that enable the first fully functional photonic engine (PE) module co-packaged with an Ethernet switch. We demonstrate the 1.6 Tbps SiPh transmitter (Tx) IC that integrates on-die all the lasers, micro ring modulators, monitor photodetectors, spot size converters, and V-grooves that are needed to support sixteen 106.25 Gbps PAM4 optical transmit channels. This SiPh Tx, together with discrete receiver (Rx) SiPh ICs, enabled an 800 Gbps PE. The PE is designed to allow up to sixteen modules to be co-packaged around a high-bandwidth switch ASIC. The PE test results described in this article were obtained using sixteen 53.125 Gbps electrical channels that were multiplexed to drive eight simultaneously operating 106.25 Gbps optical channels. We report DR4 IEEE standards compliant high-speed optical eye performance as well as full link operation. Post-FEC error-free operation over temperature and over extended time duration is demonstrated on all channels.

中文翻译:


用于交换机联合封装演示的 1.6 Tbps 硅光子集成电路和 800 Gbps 光子引擎



我们描述了基于高带宽密度硅光子的集成电路 (SiPh IC) 的性能,该集成电路实现了第一个与以太网交换机共同封装的全功能光子引擎 (PE) 模块。我们展示了 1.6 Tbps SiPh 发射器 (Tx) IC,该 IC 在芯片上集成了支持 16 个 106.25 Gbps PAM4 光传输通道所需的所有激光器、微环调制器、监控光电探测器、光斑尺寸转换器和 V 形槽。该 SiPh Tx 与分立接收器 (Rx) SiPh IC 一起实现了 800 Gbps PE。 PE 的设计允许将多达 16 个模块共同封装在高带宽交换机 ASIC 周围。本文中描述的 PE 测试结果是使用 16 个 53.125 Gbps 电通道获得的,这些通道被复用来驱动 8 个同时运行的 106.25 Gbps 光通道。我们报告符合 DR4 IEEE 标准的高速光眼性能以及全链路操作。在所有通道上都展示了 FEC 后在整个温度范围内和长时间持续时间内的无差错操作。
更新日期:2020-11-20
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