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Nest-like hetero-structured BNNS@SiCnws fillers and significant improvement on thermal conductivities of epoxy composites
Composites Part B: Engineering ( IF 13.1 ) Pub Date : 2021-02-03 , DOI: 10.1016/j.compositesb.2021.108666
Yixin Han , Xuetao Shi , Shuangshuang Wang , Kunpeng Ruan , Chuyao Lu , Yongqiang Guo , Junwei Gu

Silicon carbide nanowires (SiCnws) were in-situ grown on boron nitride nanosheets (BNNS) to construct a novel kind of nest-like hetero-structured BNNS@SiCnws thermally conductive fillers from natural bamboo leaves and tetraethyl orthosilicate (TEOS) by means of ultrasonic impregnation, sol-gel followed by carbothermic reduction. Then, the thermally conductive & electrically insulating BNNS@SiCnws/epoxy composites were prepared via blending-casting method. When the amount of BNNS@SiCnws-II (65/35, wt/wt) was 20 wt%, BNNS@SiCnws/epoxy composites presented the optimal overall performances. Thermal conductivity coefficient (λ) of BNNS@SiCnws-II (20 wt%)/epoxy composites increased from 0.22 W/mK of pure epoxy matrix to 1.17 W/mK, higher than that of SiCnws/epoxy (0.72 W/mK), BNNS/epoxy (0.82 W/mK) and (BNNS/SiCnws)/epoxy composites (direct mixing BNNS/SiCnws, 65/35, wt/wt 0.76 W/mK) with the same filler concentration of 20 wt%. Meanwhile, BNNS@SiCnws/epoxy composites presented excellent heat transfer/heat dissipation efficiency, due to synergistic effect of the “line-to-surface” hetero-structure of SiCnws and BNNS, which could significantly improve the formation probability of the thermally conductive paths. Furthermore, the BNNS@SiCnws/epoxy composites possessed favorable electrical insulation, thermostability and ideal mechanical properties. Furthermore, the related surface & volume resistivities, the electric breakdown strength, the glass-transition temperature, the heat resistant index, the flexural strength as well as the impact strength of BNNS@SiCnws-II (20 wt%)/epoxy composites reached to be 3.7 × 1015 Ω, 5.17 × 1015 Ω cm, 22.1 kV/mm, 126.7 °C, 185.5 °C, 75.7 MPa and 8.2 kJ/m2, respectively.



中文翻译:

巢状异质结构BNNS @ SiCnws填料和环氧复合材料导热性的显着改善

将碳化硅纳米线(SiCnws)原位生长在氮化硼纳米片(BNNS)上,通过超声波从天然竹叶和原硅酸四乙酯(TEOS)中构建一种新型的巢状异质结构BNNS @ SiCnws导热填料浸渍,溶胶-凝胶,然后进行碳热还原。然后,将导热&电绝缘BNNS @ SiCnws /制备环氧复合材料通过混合流延法。当BNNS @ SiCnws-II(65/35,wt / wt)的含量为20 wt%时,BNNS @ SiCnws /环氧树脂复合材料表现出最佳的整体性能。导热系数(λBNNS @ SiCnws-II(20 wt%)/环氧树脂复合材料)从纯环氧基质的0.22 W / mK增加到1.17 W / mK,高于SiCnws /环氧树脂(0.72 W / mK),BNNS /环氧树脂(0.82 W / mK)和(BNNS / SiCnws)/环氧复合材料(直接混合BNNS / SiCnws,65/35,wt / wt 0.76 W / mK),填料浓度相同,为20 wt%。同时,由于SiCnws和BNNS的“线对面”异质结构的协同作用,BNNS @ SiCnws /环氧树脂复合材料具有出色的传热/散热效率,可显着提高导热路径的形成概率。此外,BNNS @ SiCnws /环氧树脂复合材料具有良好的电绝缘性,热稳定性和理想的机械性能。此外,相关的表面和体积电阻率,击穿强度,玻璃化温度,15  Ω,5.17×10 15  Ω厘米,22.1千伏/毫米,126.7℃,185.5℃,75.7兆帕和8.2千焦耳/米2,分别。

更新日期:2021-02-03
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