Background: This article presents a micro beam, fabricated using digital light processing (DLP), one of the additive manufacturing methods. The fabrication process is based on the projection micro stereolithography method.

Objective: The micro beam, which can move in one direction (y-axis), was designed according to the specified criteria and fabricated. In the experiments carried out during the fabrication process, it showed the effect of the support structures on the fabrication of the micro beam.

Methods: For the characterization process, the micro beam connected to the probe station is connected to a circuit board with cables attached to the electrical pads. The image processing algorithm has been developed to detect the displacement of the micro beam as a result of the characterization processes. The operating voltage was increased from 0V to 2V and incremented until fracture and deterioration in the structure of the micro beam were observed.

Results: The micro beam was able to withstand distortion and breaks up to a maximum voltage of 10V. When 12V voltage was applied to the micro beam, fractures occurred in the arm. As a result of the characterization process, the maximum displacement of the micro beam was measured as 2.32 μm at 10V voltage.

Conclusion: The characterization results indicated the usability of the image processing algorithm in 3D technology.

背景：本文介绍一种使用数字光处理（DLP）（一种增材制造方法）制造的微束。制造过程基于投影微立体光刻方法。

目的：根据指定标准设计并制造可以沿一个方向（y轴）移动的微光束。在制造过程中进行的实验中，它显示了支撑结构对微束制造的影响。

方法：在表征过程中，将连接到探针台的微束通过电缆连接到电路板的方式连接到电路板上。已经开发出图像处理算法来检测由于表征过程而产生的微束位移。工作电压从0V增加到2V，然后增加直到观察到微束结构破裂和劣化。

结果：微型光束能够承受变形，并破裂到最大10V的电压。当对微束施加12V电压时，手臂发生骨折。表征过程的结果是，在10V电压下测得的微束最大位移为2.32μm。

结论：表征结果表明了该图像处理算法在3D技术中的可用性。