Special truss moment frames (STMFs) are used as the lateral force-resisting systems in buildings. Under seismic loading, the hysteretic energy dissipation in STMFs mostly occurs through the flexural plastic hinges developed in the special segments only. This study presents the seismic fragility assessment of low to high-rise STMFs with ductile Vierendeel panels as the special segments. Four building frames (i.e., 3-, 6-, 9-, and 15-story) with three different configurations of special segments in STMFs have been considered as the study frames. Nonlinear incremental dynamic analyses of the study frames have been carried out using computer software PERFORM-3D using forty-four ground motion records. The probability of exceeding the drift levels corresponding to three performance levels, viz., immediate occupancy (IO), life safety (LS), and collapse prevention (CP) of the study frames have been investigated under the design-basis earthquake and maximum considered earthquake hazard levels. The presence of intermediate vertical members in the Vierendeel panels resulted in the gradual loss in the post-peak lateral strengths of STMFs. The use of multiple Vierendeel panels significantly reduced the probability of failure of low-rise (namely, 3- and 6-story) STMFs. However, STMFs with single Vierendeel panels are found to be beneficial in 9- and 15-story building frames. The inter-story drift limits have been proposed for the performance levels of IO, LS, and CP of STMFs.

特殊的桁架弯矩框架（STMF）用作建筑物中的侧向抗力系统。在地震载荷下，STMF中的滞回能量耗散主要通过仅在特殊段中开发的挠性塑料铰链发生。这项研究提出了以韧性维埃伦代尔面板为特殊片段的低至高层STMF的地震脆性评估。研究框架考虑了四个建筑框架（即3层，6层，9层和15层）以及STMF中特殊段的三种不同配置。使用计算机软件PERFORM-3D使用了44个地面运动记录，对研究框架进行了非线性增量动力分析。超过对应三个性能水平的漂移水平的概率，即即时占用率（IO），生命安全（LS），在设计基准地震和最大考虑的地震危险等级下，研究了研究框架的抗倒塌和防塌能力。Vierendeel面板中存在中间垂直构件，导致STMF的峰后横向强度逐渐降低。使用多个Vierendeel面板显着降低了低层（即3层和6层）STMF失效的可能性。但是，发现具有单个Vierendeel面板的STMF在9层和15层建筑框架中是有益的。已为STMF的IO，LS和CP的性能水平提出了层间漂移限制。Vierendeel面板中存在中间垂直构件，导致STMF的峰后横向强度逐渐降低。使用多个Vierendeel面板显着降低了低层（即3层和6层）STMF失效的可能性。但是，发现具有单个Vierendeel面板的STMF在9层和15层建筑框架中是有益的。已经为STMF的IO，LS和CP的性能水平提出了层间漂移限制。Vierendeel面板中存在中间垂直构件，导致STMF的峰后横向强度逐渐降低。使用多个Vierendeel面板显着降低了低层（即3层和6层）STMF失效的可能性。但是，发现具有单个Vierendeel面板的STMF在9层和15层建筑框架中是有益的。已为STMF的IO，LS和CP的性能水平提出了层间漂移限制。