The fluid flow in cluster magnetorheological-porous foam finishing method (CMRFF) was studied for planner finishing in this study. A normal force model composed by magnetic and hydrodynamic force was established for CMRFF. The normal force is generated by the integral of pressure distribution on workpiece surface and the average relative error between theoretical and experimental results is less than 5.737%. CMRFF can achieve much higher normal force compared with traditional cluster magnetorheological finishing method (CMRF). In the finishing processes of silicon wafer, the surface roughness reduced from 49.66 nm to 16.991 nm in CMRFF in 45 min, compared with 50.559 nm–22.891 nm in CMRF, which indicates the effectiveness of CMRFF in improving surface finishing rate and quality.

研究了簇磁流变-多孔泡沫精加工方法（CMRFF）中的流体流动，以用于规划器精加工。建立了由电磁力和流体动力组成的法向力模型。法向力由工件表面压力分布的积分产生，理论和实验结果之间的平均相对误差小于5.737％。与传统的簇磁流变精加工方法（CMRF）相比，CMRFF可以获得更高的法向力。在硅晶片的精加工过程中，CMRFF的表面粗糙度在45分钟内从49.66 nm减小到16.991 nm，而CMRF的表面粗糙度从50.559 nm–22.891 nm减小，这表明CMRFF在提高表面精加工速率和质量方面是有效的。