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Improving plasma bonding of PDMS to gold-patterned glass for electrochemical microfluidic applications
Microfluidics and Nanofluidics ( IF 2.3 ) Pub Date : 2021-01-31 , DOI: 10.1007/s10404-021-02420-3
Carlos Luis Gonzalez-Gallardo , Alberto Díaz Díaz , Jannu R. Casanova-Moreno

Plasma-treated poly(dimethylsiloxane) (PDMS) bonds irreversibly to Si-containing substrates. In electrochemical microfluidic cells, commonly used gold electrodes are inert to this bonding method, causing leaks in the PDMS\(\vert\)Au interface. In this work, the effect of the electrode connector width on the leak was studied. Leak pressure tests show that higher leak pressures can be obtained using narrower electrode connectors. A 4 \(\upmu\)m connector width presents a leak pressure of 238±22 kPa, comparable to the typical failure pressures reported for PDMS\(\vert\)glass devices without electrodes. Finite element modeling suggests that the deformation of the PDMS under the pressure in the channel is the mechanism responsible for the sharp increase in leak resistance observed at narrow gold structures. To ensure that narrow connectors are suitable for faradaic electrochemical measurements, a model analyte was evaluated in cells with different electrode connector width. Voltammograms show that even when using the 4 \(\upmu\)m structure, ohmic drop is negligible. We propose the use of narrow electrode connectors to reliably use the simple and widespread plasma bonding method while minimizing the solution leaking.



中文翻译:

改进PDMS与金图案玻璃的等离子体键合,用于电化学微流控应用

等离子体处理的聚二甲基硅氧烷(PDMS)不可逆地结合到含Si衬底上。在电化学微流体电池中,常用的金电极对该键合方法呈惰性,导致PDMS \(\ vert \) Au界面泄漏。在这项工作中,研究了电极连接器宽度对泄漏的影响。泄漏压力测试表明,使用较窄的电极连接器可以获得较高的泄漏压力。连接器宽度为4 (\ upmu \) m时,泄漏压力为238±22 kPa,与PDMS \(\ vert \)的典型故障压力相当没有电极的玻璃设备。有限元建模表明,PDMS在通道压力下的变形是导致在窄金结构处观察到的耐泄漏性急剧增加的机制。为了确保窄的连接器适用于法拉第电化学测量,在具有不同电极连接器宽度的电池中评估了模型分析物。伏安图显示,即使使用4 \(\ upmu \) m结构,欧姆降也可以忽略不计。我们建议使用窄电极连接器,以可靠地使用简单且广泛使用的等离子键合方法,同时最大程度地减少溶液泄漏。

更新日期:2021-01-31
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