Bunch of wires (BoW) is a new open die-to-die (D2D) interface that aims to gracefully tradeoff performance for design and packaging complexity across a wide range of process nodes. BoW performance can range from 320 Gb/s/mm with a simple design and packaging to 1+ Tb/s/mm with complex design and/or packaging. BoW directly enables heterogeneous integration, a primary advantage of chiplets. We discuss progress on BoW based on extensive design and performance studies by engineers from multiple companies. These studies aim to make BoW easy to use in a system. This open innovation project will deliver a low-complexity D2D interface with competitive power-performance metrics with the economies of scale for services and technologies associated with an open ecosystem.

中文翻译：

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开放的小芯片间通信链接：电线束（BoW）

线束（BoW）是一个新的开放式裸片对裸片（D2D）接口，旨在在广泛的工艺节点中为设计和封装的复杂性适当权衡性能。BoW性能的范围从简单的设计和封装到320 Gb / s / mm，到复杂的设计和/或封装的1+ Tb / s / mm。BoW直接实现了异构集成，这是小芯片的主要优势。我们根据多家公司的工程师进行的广泛设计和性能研究，讨论BoW的进展。这些研究旨在使BoW易于在系统中使用。该开放式创新项目将提供低复杂度的D2D接口，具有竞争性的电源性能指标，并具有与开放式生态系统相关的服务和技术的规模经济。