Increasing data rates, spectrum efficiency, and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, fifth-generation (5G) networks have emerged as a follow-on to 4G and projected to have $100\times $ higher wireless date rates and $100\times $ lower latency than those with current 4G networks. Major challenges arise in the packaging of radio frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3-D ultrathin packages with higher component densities and performance than with the existing 2-D packages is needed to realize such 5G systems. This article reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

中文翻译：

---

5G前端系统软件包集成的回顾

数据速率，频谱效率和能源效率的提高已经推动了RF通信网络的设计和硬件集成方面的重大进步。为了满足数据速率和效率指标，第五代（5G）网络已成为4G的后继产品，并预计将具有 $ 100 \次$ 更高的无线日期速率和 $ 100 \次$ 与目前的4G网络相比，延迟更低。由于毫米波频段中严格的低信号损耗要求以及具有更小的占位面积和厚度的精密阻抗设计，射频前端模块的包装面临着重大挑战。为了实现这样的5G系统，需要与现有的2D封装相比，具有更高组件密度和性能的3D超薄封装进行异构集成。本文回顾了5G系统的关键组成部分以及实现这些技术的包装技术的潜在进展。