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A Die Attach Design for Thermoelectric Generator Packages for Automotive Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2020-12-09 , DOI: 10.1109/tcpmt.2020.3043455
Shams Arifeen , Victor Wolemiwa , Dominic Nwoke , Gabriel P. Potirniche , Aicha Elshabini , Fred Barlow

The requirement to achieve high reliability for the die attach in thermoelectric generator (TEG) package design is key to their viability and safe operation in automotive applications. In this study, the reliability of die attach material Al 718 (88% Al, 12% Si) during high temperature operating conditions is discussed. A novel approach is outlined to determine the damage parameter for accurate reliability predictions using a scalable test vehicle fabrication, testing, and finite element analysis (FEA) simulations. In addition, a new TEG package design is proposed that can withstand extreme environmental conditions and exhibit enhanced mechanical reliability by minimizing the likelihood that sublimation and oxidation of the semiconductor dies occurs. The proposed design of TEGs is analyzed using finite element simulations. Prototype models were fabricated and tested to validate the computational predictions. Continuum damage mechanics was used to predict the fatigue life of TEG packages using computational modeling of cyclic damage evolution. The results demonstrated that the proposed die attach design can be commercially viable for high-temperature TEG applications.

中文翻译:

用于汽车应用的热电发电机组件的管芯连接设计

对热电发生器(TEG)封装设计中的芯片连接实现高可靠性的要求,是其在汽车应用中的可行性和安全操作的关键。在这项研究中,讨论了高温运行条件下芯片连接材料Al 718(88%Al,12%Si)的可靠性。概述了一种新颖的方法,可以使用可扩展的测试车辆制造,测试和有限元分析(FEA)仿真来确定损坏参数,以进行准确的可靠性预测。此外,提出了一种新的TEG封装设计,该设计可承受极端的环境条件,并通过最大程度地降低半导体管芯升华和氧化的可能性来表现出增强的机械可靠性。使用有限元模拟分析了拟议的TEG设计。制作原型模型并进行测试以验证计算预测。连续损伤力学用于通过循环损伤演化的计算模型来预测TEG包装的疲劳寿命。结果表明,所提出的芯片连接设计在高温TEG应用中具有商业可行性。
更新日期:2021-01-26
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