In this study, the cheap copper electrode ionic polymer metal composite (IPMC) was prepared by chemical deposition. The formation mechanism of the copper electrode layer was analyzed firstly, then the surface and cross section morphology, roughness and porosity of IPMC were measured, and the interface profile was simulated and predicted based on Weierstrass-Mandelbrot (WM) function, at last, the adhesion force of the interface was calculated. The results show that the coarsening of Nafion and the adsorption of Ag⁺ ions provide a good catalytic activation site for the nucleation and rapid growth of copper particles. The copper layer on the surface of IPMC is arranged in granular, distributed compactly and uniformly, with the porosity of 52.3% and a strong (111) preferred orientation, which are beneficial to the performance of IPMC. Based on the WM function, the fractal dimension, characteristic scale and characteristic roughness are used to reflect the flatness and complexity of surface profile. The adhesive strength between the substrate and the coating is mainly due to the surface force field caused by the coarsening treatment. The theoretical and simulation studies of the interface characteristics are helpful to understand the internal mass transfer mechanism of IPMC and characterize the complex interface morphology, which also lays a foundation for the later research and application of IPMC.

在这项研究中，廉价的铜电极离子聚合物金属复合材料（IPMC）是通过化学沉积制备的。首先分析铜电极层的形成机理，然后测量IPMC的表面和横截面形态，粗糙度和孔隙率，并基于Weierstrass-Mandelbrot（WM）函数模拟和预测界面轮廓，最后，计算界面的粘附力。结果表明，Nafion的粗化和Ag ⁺的吸附离子为铜颗粒的形核和快速生长提供了良好的催化活化位点。IPMC表面的铜层呈颗粒状排列，分布紧凑，均匀，孔隙率为52.3％，具有较好的（111）择优取向，有利于IPMC的性能。基于WM函数，使用分形维数，特征尺度和特征粗糙度来反映表面轮廓的平坦度和复杂性。基材与涂层之间的粘合强度主要归因于由粗化处理引起的表面力场。界面特性的理论和仿真研究有助于理解IPMC的内部传质机理并表征复杂的界面形态，