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Comparative Study on Using Ultrasonic Array-Based Techniques for Detection of Flaws in Thick and Attenuating Materials
Transactions of the Indian Institute of Metals ( IF 1.5 ) Pub Date : 2021-01-21 , DOI: 10.1007/s12666-020-02181-7
Sumana , S. Ponseenivasan , Anish Kumar

This paper reports the influence of thickness and material attenuation on volumetric inspection using conventional and advanced ultrasonic array-based techniques through suitable examples. The sensitivity achieved in conventional phased array ultrasonic testing technique with focusing at specific depth using delay laws and advanced array-based techniques for simultaneous focusing at all depths such as Full Matrix Capture-Total Focusing Method and plane wave imaging-TFM are compared in the present study. Finally, experimental results are discussed for advanced ultrasonic array-based techniques for detection and characterization of a 4 mm through wall dimension vertical planar defect (simulating a lack of side wall fusion in a thick narrow gap weld) in a nickel base alloy forging having fine and coarse grains. The sensitivities and signal-to-noise ratio achieved in the different techniques are discussed in detail.



中文翻译:

基于超声阵列技术检测厚弱性材料缺陷的比较研究

本文通过适当的示例,介绍了使用传统和先进的基于超声阵列的技术,厚度和材料衰减对体积检测的影响。目前,比较了使用延迟定律在特定深度聚焦的常规相控阵超声测试技术和在所有深度同时聚焦的先进基于阵列的技术(如全矩阵捕获-总聚焦法和平面波成像-TFM)实现的灵敏度。研究。最后,讨论了基于超声阵列的先进技术的实验结果,该技术用于检测和表征壁厚为4 mm的垂直平面缺陷(模拟厚的窄缝焊缝中没有侧壁熔合),在具有良好细度的镍基合金锻件中和粗粮。

更新日期:2021-01-22
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