Graphene was ball-milled with copper powder to acquire copper-graphene (CuG) powder. One and two percent of CuG in weight were added to stacking layers of fully annealed copper sheets and processed using 2, 4 and 6 cycles of accumulative roll bonding (ARB), leading to 2 mm thick copper-graphene nanocomposites with 20, 80 and 320 layers. With respect to the initially annealed copper sheet, the strength of the nanocomposites increased to the cost of significant loss in ductility. Reduced ductility was attributed to the low bonding quality in the form of existence of voids and the graphene chemistry which resulted in delamination and decohesion of the stacking sheets forming the nanocomposite during tensile tests. After 2 and 4 cycles of ARB, the electrical resistivity was increased which was attributed to the high density of defects and dislocations in addition to poor bonding between the stacking layers of the nanocomposite. Reduced electrical resistivity was achieved after 6 cycles of ARB which can be an indication of the improvement of the bonding at the interface of the nanoparticles with the matrix in addition to the reduction in voids at the interfaces of the stacking layers of sheets. Comparison between the nanocomposites with similarly fabricated multilayer sheets with no graphene addition indicated reduction in resistivity which demonstrates the positive effects of graphene on reducing resistivity. Mechanical strength, ductility and electrical resistivity were found to improve in the nanocomposite with 2% of CuG addition which was followed by further reduction in resistivity by full annealing.

将石墨烯与铜粉进行球磨，以获得铜石墨烯（CuG）粉末。将重量的1％和2％的CuG添加到完全退火的铜板的堆叠层中，并使用2、4和6个循环的累积辊压粘合（ARB）周期进行处理，从而得到厚度为20 mm，厚度为20、80和320的铜石墨烯纳米复合材料层。相对于最初退火的铜片，纳米复合材料的强度增加了延展性的显着损失。延展性降低归因于存在空隙和石墨烯化学形式的低键合质量，这导致在拉伸试验过程中形成纳米复合材料的堆叠片材脱层和脱粘。经过2和4个循环的ARB之后，电阻率增加，这归因于缺陷和位错的高密度，以及纳米复合材料堆叠层之间的不良键合。在ARB的6个循环之后实现了降低的电阻率，这可以表明除了减少片材的堆叠层的界面处的空隙之外，纳米颗粒与基质的界面处的键合也得到了改善。纳米复合材料与没有石墨烯添加的类似制造的多层片材之间的比较表明电阻率降低，这表明石墨烯对降低电阻率具有积极作用。机械强度，