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Modeling temperature rise in multi-track reciprocating frictional sliding
Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology ( IF 1.6 ) Pub Date : 2021-01-19 , DOI: 10.1177/1350650120988230
Thierry A Blanchet 1
Affiliation  

As in various manufacturing processes, in sliding tests with scanning motions to extend the sliding distance over fresh countersurface, temperature rise during any pass is bolstered by heating during prior passes over neighboring tracks, providing a “heat accumulation effect” with persisting temperature rises contributing to an overall temperature rise of the current pass. Conduction modeling is developed for surface temperature rise as a function of numerous inputs: power and size of heat source; speed and stroke length, and track increment of scanning motion; and countersurface thermal properties. Analysis focused on mid-stroke location for passes of a square uniform heat flux sufficiently far into the rectangular patch being scanned from the first pass at its edge that steady heat accumulation effect response is adopted, focusing on maximum temperature rise experienced across the pass' track. The model is non-dimensionalized to broaden the applicability of the output of its runs. Focusing on practical “high” scanning speeds, represented non-dimensionally by Peclet number (in excess of 40), applicability is further broadened by multiplying non-dimensional maximum temperature rise by the square root of Peclet number as model output. Additionally, investigating model runs at various non-dimensional speed (Peclet number) and reciprocation period values, it appears these do not act as independent inputs, but instead with their product (non-dimensional stroke length) as a single independent input. Modified maximum temperature rise output appears to be a function of only two inputs, increasing with decreasing non-dimensional values of stroke length and scanning increment, with outputs of models runs summarized compactly in a simple chart.



中文翻译:

多轨往复式摩擦滑动中的温升建模

与在各种制造过程中一样,在通过扫描运动进行滑动测试以延长新的相对表面上的滑动距离的滑动测试中,任何通过过程中的温度升高都可以通过在先前遍历相邻轨道上的过程中的加热来加强,从而提供“蓄热效应”,持续的温度升高有助于电流通过的总体温升。开发了传导模型,以根据许多输入函数来提高表面温度:功率和热源大小;速度和行程长度,以及扫描运动的轨迹增量;和相对表面的热性能。分析着眼于中风位置,以确保方形均匀的热通量从第一道通过的边缘开始足够远地进入矩形小块,而矩形块的边缘采用了稳定的蓄热效应响应,着眼于整个通道的最大温升。该模型未进行尺寸标注,以扩展其运行输出的适用性。着眼于实际的“高”扫描速度(用Peclet数无量纲表示(超过40)),通过将无量纲的最大温升乘以Peclet数的平方根作为模型输出,进一步扩大了适用性。此外,调查模型以各种无量纲的速度(Peclet数)和往复周期值运行,它们似乎不充当独立的输入,而是将其乘积(无量纲的笔画长度)作为单个独立的输入。修改后的最大温升输出似乎只是两个输入的函数,

更新日期:2021-01-19
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