ABSTRACT This study is focused on finding optimised conditions for electrodeposition of NiP and NiP/SiC coatings, which enhance the coatings' microhardness. Both the effect of particles and the effect of heat treatment at 400°C for 1 h on the microhardness of the coating were studied. The effects of pulse electrodeposition parameters including duty cycle, frequency, and peak current density on the composition of NiP and NiP/SiC composite coatings were examined, and the results were compared with those from direct current plating. Pulse plating increased the current efficiency of NiP deposition while decreasing the phosphorus content of these coatings in comparison to direct plating, resulting in higher microhardness values. It was also shown that wt.%P in NiP coating depends not only on peak current density but also on bath charge of pulse plating. Pulse plating parameters (duty cycle and frequency) and the low incorporation of SiC particles did not affect microstructure or the microhardness of the coatings, while heat treatment was the main factor that increased microhardness.

中文翻译：

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脉冲电镀参数对NiP和NiP/SiC涂层电沉积及其显微硬度值的影响研究

摘要 本研究的重点是寻找电沉积 NiP 和 NiP/SiC 涂层的优化条件，以提高涂层的显微硬度。研究了颗粒的影响和在 400°C 下热处理 1 小时对涂层显微硬度的影响。研究了脉冲电沉积参数（包括占空比、频率和峰值电流密度）对 NiP 和 NiP/SiC 复合涂层成分的影响，并将结果与​​直流电镀的结果进行了比较。与直接电镀相比，脉冲电镀提高了 NiP 沉积的电流效率，同时降低了这些涂层的磷含量，从而获得更高的显微硬度值。还表明wt。NiP 涂层中的 %P 不仅取决于峰值电流密度，还取决于脉冲电镀的浴液电荷。脉冲电镀参数（占空比和频率）和 SiC 颗粒的低掺入不影响涂层的微观结构或显微硬度，而热处理是提高显微硬度的主要因素。