The effects of Ni foam addition and solid-liquid electromigration on the bonding of Cu/Sn-3.0Ag-0.5Cu/Cu joints under condition of 320 °C for 2, 4 and 8 h with the electric densities of 0, 3.33 and 6.67 × 10² A/cm² were investigated. The results indicated that intermetallic compounds (IMCs) performed non-interfacial growth in the Cu/Ni foam/SAC305 system and were distributed in an island-like aggregation, and the asymmetric growth pattern of IMCs in both the cathode and anode sides disappeared after addition of Ni foam. In addition, the grain size of IMCs was significantly reduced and the tensile strength of the joints was enhanced by the addition of Ni foam. However, when the current density reached 6.67 × 10² A/cm², the tensile strength of the joints containing Ni foam decreased dramatically after bonding for 8 h, this was due to the fact that IMCs grains were excessively coarse and the grain growth direction tended to be parallel to the current direction during bonding.

Ni泡沫的添加和固液电迁移对Cu / Sn-3.0Ag-0.5Cu / Cu接头在320°C，2、4和8 h，电密度分别为0、3.33和6.67的结合的影响研究×10 ² A / cm ²。结果表明，金属间化合物（IMCs）在Cu / Ni泡沫/ SAC305体系中无界面生长，并呈岛状聚集分布，添加后，阴极和阳极两侧的IMC的不对称生长方式消失。镍泡沫。此外，通过添加镍泡沫，IMC的晶粒尺寸显着减小，并且接头的拉伸强度得到增强。但是，当电流密度达到6.67×10 ² A / cm ^2时，在粘结8 h后，含Ni泡沫的接头的抗拉强度急剧下降，这是由于在粘结过程中IMCs晶粒过粗，晶粒生长方向趋于平行于电流方向。