With the aim to develop electrically conductive adhesives (ECAs) as alternatives for traditional lead-based or lead-free solders in electronic packaging, we report an outstanding enhancement of electrical conductivity of epoxy ECAs filled with silver nanoparticles (AgNP)-decorated graphene nanoplatelets (AgNP@GNP). In order to avoid the deterioration of the superior properties of GNP, the GNP is directly sensitized by Sn precursor without conventional harsh-conditioned graphene oxide (GO) preparation, followed by the decoration of AgNP on sensitized GNP. The structural and morphological properties of AgNP@GNP were characterized using XRD, TEM, Raman, and TGA. The excellent distribution of SnO₂ and AgNP on GNP could be explained by the attractive force between protonated GNP (pH < 1; zeta potential > +20 mV) and lone-paired stannous ions. The electrical conductivity of as-prepared AgNP@GNP (1.3 × 10⁵ S/cm) was nearly 6500 times than that of pristine GNP. Moreover, the electrical conductivity of the 20 vol% AgNP@GNP/epoxy ECAs was almost 500 times higher than that of pristine GNP/epoxy and 27-fold higher than that of conventional AgNP@GO/epoxy ECA.

为了开发可替代电子封装中传统铅基或无铅焊料的导电胶（ECA），我们报告了填充有银纳米颗粒（AgNP）修饰的石墨烯纳米片的环氧ECA的导电性显着提高（ AgNP @ GNP）。为了避免恶化GNP的优良性能，无需先进行苛刻的氧化石墨烯（GO）制备，直接用Sn前驱物敏化GNP，然后在敏化的GNP上装饰AgNP。用XRD，TEM，Raman和TGA对AgNP @ GNP的结构和形态特性进行了表征。SnO ₂的优异分布AgNP对GNP的影响可以通过质子化GNP（pH <1；ζ电位> +20 mV）和孤对亚锡离子之间的吸引力来解释。制备的AgNP @ GNP的电导率（1.3×10 ⁵  S / cm）是原始GNP的电导率的近6500倍。此外，20％（体积）AgNP @ GNP /环氧ECA的电导率几乎是原始GNP /环氧树脂的500倍，是传统AgNP @ GO /环氧ECA的27倍。