The relatively weak interfacial bond and brittleness of cold sprayed deposits limit their industrial applications for the fabrication of complex structural components. In this study, pure copper, as a typical material for cold spray additive manufacturing (CSAM), was deposited and then post-processed with conventional heat treatment (HT) and newly developed electric pulse processing (EPP) and friction stir processing (FSP), in order to improve the microstructure and mechanical properties of the deposits. The results show that EPP, FSP, and HT can heal the weak interfaces between deposited particles, with EPP and FSP being considerably better than HT. Recrystallized fine grains and elongated grains at the interfacial regions transformed into coarser grains after EPP and HT. FSP refinement affects the grains of the whole deposit and completely rearranges the topology of the deposited particles. Mechanical tests reveal that an ultimate tensile strength of 310 MPa and elongation of 40% were reached after FSP, while the ultimate tensile strength of 209 MPa and elongation of 19% were reached with EPP. The main strengthening mechanisms of the EPP deposit are the improved bonding at the interfaces and the high angle grain boundaries and twins. For the FSP deposit, the improved interface bonding, the superfine grains along with the strain hardening effect are the main strengthening mechanisms.

冷喷涂沉积物的相对较弱的界面粘结性和脆性限制了其在制造复杂结构部件时的工业应用。在这项研究中，沉积了纯铜，作为用于冷喷涂添加剂制造（CSAM）的典型材料，然后通过常规热处理（HT），新开发的电脉冲处理（EPP）和摩擦搅拌处理（FSP）进行后处理，以改善沉积物的微观结构和机械性能。结果表明，EPP，FSP和HT可以修复沉积颗粒之间的薄弱界面，而EPP和FSP则比HT好得多。经过EPP和HT处理后，界面区域的重结晶细晶粒和拉长晶粒转变为粗晶粒。FSP精制会影响整个沉积物的晶粒，并完全重新排列沉积粒子的拓扑。力学测试表明，FSP后达到310 MPa的极限抗拉强度和40％的伸长率，而EPP达到209 MPa的极限抗拉强度和19％的伸长率。EPP沉积物的主要强化机制是在界面处以及高角度晶界和孪晶处的键合改善。对于FSP沉积物，主要的强化机理是改善的界面结合，超细晶粒以及应变硬化效果。而EPP的极限抗拉强度为209 MPa，伸长率为19％。EPP沉积物的主要强化机制是在界面处以及高角度晶界和孪晶处的键合改善。对于FSP沉积物，主要的强化机制是改善的界面结合，超细晶粒以及应变硬化效果。而EPP的极限抗拉强度为209 MPa，伸长率为19％。EPP沉积物的主要强化机制是在界面处以及高角度晶界和孪晶处的键合改善。对于FSP沉积物，主要的强化机理是改善的界面结合，超细晶粒以及应变硬化效果。