The impact of the electric field between rough copper lines on the failure time for electrochemical migration (ECM) in printed circuit boards is analyzed by means of modeling. The understanding and assessment of the failure time and thus the reliability becomes more and more important as the dimensions in the printed circuit boards decrease and the applied voltages increase. Once the epoxy/glass fiber interface is degraded in the printed circuit board, the additional time to form either Conducting Anodic Filaments (CAF) or dendrites depends also on the electric field. This electric field, as the main driving force, was computed on virtually constructed rough surfaces to take the real copper/prepreg interface into account before the onset of corrosion. It was shown, that roughness peaks increase the local maximum electric field, which follows a $E=\raisebox{1ex}{$U$}\!\left/ \!\raisebox{-1ex}{$d^{0.63}$}\right.$-relation that is underestimated in the state-of-the-art approach. Furthermore, it was found that the material dependent parameters can be related to the tortuosity of the possible short circuit path and the ion mobility in the material. The enhanced model for the determination of the failure time will facilitate the fitting and interpretation of future testing procedures.

通过建模分析了粗铜线之间的电场对印刷电路板中电化学迁移（ECM）失效时间的影响。随着印刷电路板尺寸的减小和施加电压的增加，对故障时间以及可靠性的理解和评估变得越来越重要。一旦环氧/玻璃纤维界面在印刷电路板上退化，形成导电阳极丝（CAF）或树枝状晶体的额外时间也取决于电场。该电场作为主要驱动力，是在虚拟构造的粗糙表面上计算出来的，以便在腐蚀发生之前考虑到实际的铜/预浸料界面。结果表明，粗糙度峰值增加了局部最大电场，其遵循$Ë=\raisebox{1ex}{$ü$}\!\left/ \!\raisebox{-1ex}{$d^{0.63}$}\right.$-最新技术中被低估的关系。此外，已经发现，取决于材料的参数可以与可能的短路路径的曲折度和材料中的离子迁移率有关。用于确定故障时间的增强模型将有助于将来测试程序的拟合和解释。