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Thermal Design Optimization of the Printed Circuit Board through Area Reduction
Heat Transfer Engineering ( IF 1.6 ) Pub Date : 2021-01-13
Cristina Mihaela Dragan, Dorin Lelea

ABSTRACT

The dimensions of an electronic control unit are extremely important in the developing of any new product design. It is well known that a large area of the PCB (printed circuit board) increases thermal performance. For any developed product, when the PCB area is enlarged, the volume, the mass, and the surroundings also increase. The current paper presents how the shape is more important than the area and the way in which the area of the PCB can be reduced but still has similar or even better thermal performance. An RSM (response surface methodology) of the DOE (design of experiments) quality tool from optimization phase of design for six sigma concept was developed using MINITAB statistical software. The results for each DOE combination of length and width were simulated as a parametric run by the ICEPAK 19.1 commercial software, which is based on the finite volume method. Numerical analyzes check the obtained transfer function for other dimensions than those analyzed in response surface DOE and it is extrapolated for different areas. With the obtained and numerically checked RSM transfer function, it is recognized a significantly better thermal performance for the same area of the PCB, but with a smaller dimension in the airflow direction.



中文翻译:

通过减少面积来优化印刷电路板的热设计

摘要

电子控制单元的尺寸在任何新产品设计的开发中都非常重要。众所周知,PCB(印刷电路板)的大面积提高了热性能。对于任何开发的产品,当扩大PCB面积时,体积,质量和周围环境也会增加。当前的论文展示了形状比面积更重要的原因以及可以减小PCB面积但仍具有相似甚至更好的热性能的方式。使用MINITAB统计软件,从6σ概念的设计优化阶段开发了DOE(实验设计)质量工具的RSM(响应面方法)。ICEPAK 19.1商业软件将每个DOE长度和宽度组合的结果作为参数运行进行模拟,这是基于有限体积法的。数值分析会检查所获得的传递函数是否具有其他尺寸,而不是在响应面DOE中进行分析,并针对不同区域进行推断。通过获得并经过数值检验的RSM传递函数,可以发现对于PCB的相同面积,其热性能显着提高,但在气流方向上的尺寸较小。

更新日期:2021-01-13
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