This study developed a small, three-axis force sensor with a 3D microstructure for installation into a robot gripper. The sensor was manufactured by high-temperature punch creep-forming of 5 μm thick single-crystal silicon (Si) cantilevers during an impurity diffusion process for piezoresistors. The punch creep-forming could achieve a large out-of-plane deformation of the Si cantilevers within a small area. The punch creep-forming simulations were conducted for designing the 3D formed force sensor based on the creep constitutive equation for a 5 μm thick Si film at 1050 C. Consequently, this study succeeded in fabricating a 3D formed force sensor with a 320 μm diameter hemispheric structure by punch creep-forming without breaking the structure. The force sensor was set on a printed circuit board and packaged using urethane resin. The viscoelastic response of the resin-packaged sensor was evaluated by conducting stress-relaxation (SR) tests and dynamic mechanical analysis, and characterized by a five-element generalized Maxwell model (GMM). In the SR tests, the sensor output signal in the vertical direction showed a strong correlation with the displacement applied to the test, whereas that in the lateral direction was closely related to the load acting on the sensor. Numerical analyses based on the GMM could estimate the load and displacement acting on the sensor from its output signal.

这项研究开发了一种具有3D微观结构的小型三轴力传感器，可以安装到机器人夹具中。该传感器是通过高温蠕变冲床形成5的制造μ期间压敏电阻器的杂质扩散处理M厚的单晶硅（Si）的悬臂。冲头蠕变成形可以在较小的区域内实现Si悬臂的大平面外变形。冲头蠕变成形模拟，基于该蠕变构方程设计3D形成力传感器进行了5 μ在1050℃。结果微米厚Si膜，本研究成功地制造3D形成力传感器用320 μ直径为m的半球形结构通过冲压蠕变成形而不会破坏结构。力传感器安装在印刷电路板上，并使用聚氨酯树脂进行包装。通过进行应力松弛（SR）测试和动态力学分析来评估树脂封装传感器的粘弹性响应，并以五元素广义Maxwell模型（GMM）为特征。在SR测试中，垂直方向上的传感器输出信号与施加到测试的位移显示出很强的相关性，而横向方向上的传感器输出信号则与作用在传感器上的负载密切相关。基于GMM的数值分析可以根据传感器的输出信号估计作用在传感器上的载荷和位移。