In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 ${\mu }\rm{m}$ and 50 ${\mu }\rm{m}$ that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 ${\mu }\rm{m}$ to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept.

中文翻译：

---

用于测试光子集成电路的高密度多通道无源对准光学探头

在这项工作中，我们报告了节距为 25 的高密度多通道光学多探头的结果 ${\mu}\rm{m}$ 和 50 ${\mu}\rm{m}$提供边缘耦合，用于光子集成电路的晶圆上并行测试。探针是在氮氧化物平台上制造的，测试演示是在边缘耦合的磷化铟基光子集成电路 (PIC) 上进行的。三十二个光学并行连接同时通过集成引导通道在探头和 PIC 之间无源对齐。初始贴装公差大于4 ${\mu}\rm{m}$以小于 1 dB 的光功率变化提供无源对准。报告了多端口环回光功率测量值，并测量了集成半导体光放大器的波长相关净模态增益，以进一步验证该概念。