Abstract

In Micro-Electro-Mechanical System (MEMS) area, micro metal devices can be fabricated by the micro electroforming process. However, due to the oxide layer of the substrate surface, the electroforming layer suffers from poor adhesion strength. In order to reduce the oxide layer of the substrate surface, the effects of the ultrasonic electrochemical potential activation method to reduce the oxide layer of the substrate surface are investigated originally. The electrochemical methods including the cyclic voltammetry method and the chronopotentiometric method were processed by an electrochemical station. The oxygen content of the substrate surface was measured by the EDS method. The adhesion strength between the electroforming Ni layer and the Cu substrate was measured by the scratch test. The experimental results show that comparing with the ultrasound free one, the ultrasonic electrochemical potential activation method can improve the hydrogen evolution reaction and reduce the Cu substrate surface oxide content. The results of this paper can provide a new ultrasonic electrochemical potential activation method to activate the oxide layer of the substrate surface, as well as to improve the interfacial adhesion performance.

摘要

在微机电系统（MEMS）领域，可以通过微电铸工艺制造微金属器件。然而，由于基板表面的氧化物层，电铸层的粘合强度差。为了减少衬底表面的氧化物层，最初研究了超声电化学电势活化方法减少衬底表面的氧化物层的效果。电化学方法包括循环伏安法和计时电位法。基板表面的氧含量通过EDS法测量。通过刮擦试验测量电铸Ni层和Cu基底之间的粘合强度。实验结果表明，与游离超声相比，超声电化学势活化方法可以改善析氢反应，降低铜基体表面氧化物含量。本文的结果可提供一种新的超声电化学电势活化方法，以活化基底表面的氧化层，并提高界面粘合性能。