In this research, thermally conductive polyamide 6/hexagonal boron nitride (PA6/hBN) nanocomposites waaere fabricated via an in-situ ring-opening polymerization of ε-caprolactam. The hBN filler was exfoliated through a co-solvent exfoliation process and then chemically modified to form an ε-caprolactam-grafted BN (cBN). After that, PA6 was introduced onto the cBN surface using a grafting from method. The thermal conductivities of the PA6/cBN composites significantly increased up to 180 % when the BN content was 16.5 wt%. The tensile strength and Young’s modulus of the PA6/cBN composites with 16.5 wt% hBN increased by 30 % and 92 %, respectively, compared to the pristine PA6. The grafted PA6 on BN composites exhibited strong polymer-filler interfacial interactions. Overall, this study provides a facile method of fabricating high-performance PA6 with improved thermal and mechanical properties and higher thermal conductivity.

在这项研究中，通过原位制备导热聚酰胺6 /六方氮化硼（PA6 / hBN）纳米复合材料ε-己内酰胺的开环聚合。通过共溶剂剥离工艺将hBN填料剥离，然后进行化学修饰以形成ε-己内酰胺接枝的BN（cBN）。之后，使用接枝法将PA6引入cBN表面。当BN含量为16.5 wt％时，PA6 / cBN复合材料的导热率显着提高至180％。与原始PA6相比，hBN为16.5 wt％的PA6 / cBN复合材料的拉伸强度和杨氏模量分别增加了30％和92％。BN复合材料上的接枝PA6表现出很强的聚合物-填料界面相互作用。总的来说，这项研究提供了一种制造高性能PA6的简便方法，该PA6具有改进的热力学性能和更高的导热率。