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Effects of BOX thickness, silicon thickness, and backgate bias on SCE of ET-SOI MOSFETs
Microelectronic Engineering ( IF 2.6 ) Pub Date : 2021-01-08 , DOI: 10.1016/j.mee.2021.111506
Meihua Su , Chuyang Hong , Sorin Cristoloveanu , Yuan Taur

In this work, we investigate the effect of BOX (Buried OXide) and silicon thickness on the SCE (Short-Channel Effects) of ET-SOI (Extremely Thin Silicon-on-Insulator) MOSFETs. It is found that the minimum channel length Lmin is only moderately sensitive to the BOX thickness but strongly dependent on the silicon thickness. For a given threshold voltage, the choice of gate work function in combination with the backgate bias also plays a role on Lmin. Reverse bias mitigates SCE while forward bias aggravates SCE. An empirical expression of Lmin in terms of silicon thickness is given.



中文翻译:

BOX厚度,硅厚度和背栅偏压对ET-SOI MOSFET的SCE的影响

在这项工作中,我们研究了BOX(掩埋氧化物)和硅厚度对ET-SOI(极薄绝缘体上硅)MOSFET的SCE(短沟道效应)的影响。发现最小沟道长度L min仅对BOX厚度适度敏感,而在很大程度上取决于硅厚度。对于给定的阈值电压,栅极功函数的选择与背栅偏置的组合也对L min起作用。反向偏置可减轻SCE,而正向偏置则会加剧SCE。给出了根据硅厚度的L min的经验表达式。

更新日期:2021-01-28
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