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Application of Digital Image Correlation (DIC) Technique for Semi Interlocking Masonry (SIM) Panels under Large Cyclic In-Plane Shear Displacement
Experimental Techniques ( IF 1.5 ) Pub Date : 2021-01-07 , DOI: 10.1007/s40799-020-00423-3
M. Akhtar Hossain , Y.Z. Totoev , M.J. Masia

Semi interlocking masonry (SIM) is an innovative masonry building system which is being developed in the Centre for Infrastructure Performance and Reliability at The University of Newcastle, Australia. It utilizes a special method of interlocking of mortar-less engineered masonry panels made of semi-interlocking masonry (SIM) units which possess significant energy dissipation capacity due to friction on sliding bed joints between units of the panel during a seismic event. This special method of interlocking SIM bricks allows relative sliding of unit courses in-plane of a wall and prevents out-of-plane relative movement of units. Because all bed joints in a SIM panel are sliding joints, SIM panels can withstand large in-plane displacements without damage. To test SIM panels, a special steel frame with pin connections at each corner was designed and built. The arrangement with pin connections allows application of in-plane shear distortion to the panel of up to 120 mm. The study presented herein focused on the experimental investigation of displacement capacities of three different types of panels (panel with open gap between the steel frame and top of the panel, panel with foam in the gap, panel with grout in the gap) with two types of SIM units. The paper expands significantly from the previously published conference paper and examines the behavior of SIM panels subject to 100 mm (5% storey drift) cyclic in-plane lateral displacement on six SIM panels. The horizontal and vertical movement of SIM units were recorded using Digital Image Correlation (DIC) every 10 s over approximately 8 h of testing. This study reveals that the DIC displacement outputs show good agreement with displacements measured using traditional instrumentation, even at large displacements (up to 100 mm). The structural performance of the SIM panels is also analyzed and potential joint opening widths are quantified under large displacement by plotting the outputs from DIC results.

中文翻译:

数字图像相关(DIC)技术在大循环平面剪切位移下的半互锁砌体(SIM)面板中的应用

半联锁砌体 (SIM) 是一种创新的砌体建筑系统,正在澳大利亚纽卡斯尔大学基础设施性能和可靠性中心开发。它利用一种特殊的互锁方法,由半互锁砌体 (SIM) 单元制成的无砂浆工程砌体面板互锁,由于在地震事件期间面板单元之间的滑动床接头上的摩擦,这些单元具有显着的能量耗散能力。这种互锁 SIM 砖的特殊方法允许单元层在墙的平面内相对滑动,并防止单元的平面外相对移动。由于 SIM 面板中的所有床接头都是滑动接头,因此 SIM 面板可以承受较大的平面内位移而不会损坏。要测试 SIM 面板,设计并建造了一个特殊的钢框架,每个角都有销钉连接。带销连接的布置允许将面内剪切变形应用到最大 120 毫米的面板上。本文提出的研究侧重于对三种不同类型的面板(钢框架和面板顶部之间具有开放间隙的面板、间隙中有泡沫的面板、间隙中有灌浆的面板)的位移能力进行实验研究SIM 单元的数量。该论文对之前发表的会议论文进行了显着扩展,并检查了 SIM 面板在六个 SIM 面板上受到 100 毫米(5% 层位移)循环平面内横向位移的影响。在大约 8 小时的测试中,每 10 秒使用数字图像相关 (DIC) 记录 SIM 单元的水平和垂直移动。这项研究表明,即使在大位移(高达 100 毫米)下,DIC 位移输出也与使用传统仪器测量的位移显示出良好的一致性。还分析了 SIM 面板的结构性能,并通过绘制 DIC 结果的输出来量化大位移下的潜在接头开口宽度。
更新日期:2021-01-07
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