Phase change material (PCM) based heat sink has the potential to be applied for the thermal management of electronic devices. Whereas, PCM suffers from a low thermal conductivity, which results in local overheating at the base of heat sink. To enhance thermal performance of heat sink, a structured porous material (SPM) used as thermal conductivity enhancer (TCE) is designed and fabricated, where 3D printing technique is adopted to achieve the fast and precise manufacture of SPM. The thermal response of heat sink using SPM with different porosities (80%, 85%, 90%, and 95%) is experimentally investigated at various heating power levels (8 W, 10 W, and 12 W). Results show that the use of SPM has a significant effect on thermal response of heat sink for electronic cooling system. Furthermore, the thermal behavior of heat sink can be further heightened by reducing the porosity of SPM, e.g., the heat sink using SPM with 80% porosity shows the highest enhancement ratio in all cases of present study. The increase of power level can result in the reduction of operation time of PCM-based heat sink. This study is of great significance for the design and application of SPM used in thermal management unit.

基于相变材料（PCM）的散热器有潜力应用于电子设备的热管理。而PCM的导热系数很低，这会导致散热器底部的局部过热。为了提高散热器的热性能，设计并制造了用作导热系数（TCE）的结构化多孔材料（SPM），并采用3D打印技术来实现SPM的快速，精确制造。使用不同孔隙率（80％，85％，90％和95％）的SPM在不同的加热功率水平（8 W，10 W和12 W）下研究了散热器的热响应。结果表明，使用SPM会对电子冷却系统的散热器的热响应产生重大影响。此外，通过降低SPM的孔隙率，可以进一步提高散热器的热性能，例如，在当前研究的所有情况下，使用孔隙率为80％的SPM的散热器均显示出最高的增强率。功率水平的提高可以缩短基于PCM的散热器的工作时间。这项研究对于热管理单元中SPM的设计和应用具有重要意义。