Double cantilever beam (DCB) specimens were prepared according to standard surface mount technology (SMT). The samples were stored inside an environmental chamber at two different relative humidity values (i.e. 40 or 100%) for either 2 or 4 h. Then they were aged at 25 °C, 75 °C or 125℃ for the same time. Finally, after being cooled to room temperature, fracture tests were performed under mode-I loading conditions at a strain rate of 0.03 s⁻¹ at room temperature. Storage time did not have a significant effect on the fracture behavior. The fracture load and energy of the solder joints decreased significantly when the temperature was increased from 25 to 75℃. By further increase in the temperature from 75 to 125℃, the fracture strength slightly increased. This behavior was attributed to the thickness of intermetallic compound (IMC) as well as the portion of brittle phases on the joint microstructure. The influence of relative humidity on the fracture strength was less than the temperature effect due to coarsening behavior of microstructure with a humidity rise. The fracture surface of the specimen stored at a temperature of 25℃ and relative humidity of 40% was flat and smooth, while in other cases, the fracture surfaces showed a three-dimensional roughness.

根据标准表面贴装技术（SMT）制备双悬臂梁（DCB）标本。将样品以两个不同的相对湿度值（即40％或100％）存储在环境室内2到4小时。然后将它们同时在25°C，75°C或125℃下老化。最后，在冷却至室温之后，在I型载荷条件下以0.03 s ^-1的应变速率进行断裂试验。在室温下。储存时间对断裂行为没有显着影响。当温度从25℃升高到75℃时，焊点的断裂载荷和能量显着降低。通过将温度从75℃进一步升高到125℃，断裂强度略有提高。此行为归因于金属间化合物（IMC）的厚度以及接头微结构上的脆性相部分。相对湿度对断裂强度的影响小于温度效应，这是由于随着湿度的升高组织的粗化行为。在25℃的温度和40％的相对湿度下保存的试样的断裂表面是平坦而光滑的，而在其他情况下，断裂表面则表现出三维粗糙度。