The continuous trend of miniaturization leads to unprecedented power densities within electronic devices, which also becomes the bottleneck of the device performance. Effective cooling of electronic devices is critical and polymer-based materials may play an important role in this important direction, with advantages such as low cost, corrosion resistance, light weight, and flexibility. For thermal management applications, the intrinsically low thermal conductivities of amorphous polymers can be dramatically enhanced with strain-induced crystallization and ultra-high-conductivity fillers. In this mini review, some advancements in this field are summarized and discussed, followed by a prospective on future directions.

小型化的持续趋势导致电子设备中空前的功率密度，这也成为设备性能的瓶颈。电子设备的有效冷却至关重要，聚合物基材料可能会在这一重要方向上发挥重要作用，并具有成本低，耐腐蚀，重量轻和柔韧性好等优点。对于热管理应用，可通过应变诱导结晶和超高电导率填料显着提高无定形聚合物固有的低热导率。在本小型复习中，总结和讨论了该领域的一些进展，然后展望了未来的发展方向。