Plasma deposition of a stable SiOx‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties,Plasma Processes and Polymers

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Plasma deposition of a stable SiOx‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties
Plasma Processes and Polymers ( IF 2.9 ) Pub Date : 2021-01-04 , DOI: 10.1002/ppap.202000209
Hamid R. Mohammadi ₁ , Hamed Taghvaei ₂ , Ataollah Rabiee ₁

Affiliation

In this study, a thin film composed of inorganic SiO_x is deposited on the copper surface by atmospheric pressure plasma‐enhanced chemical vapor deposition. A pool boiling experiment is performed and the influence of the coating on pool boiling performance is examined. Morphology, composition, and wettability of the thin films are assessed using a scanning electron microscope, energy‐dispersive X‐ray spectrometer, and contact angle measurements. In addition to the enhancement of pool boiling thermal characteristics, especially a 103% increase in heat transfer coefficient, it is observed that the plasma‐deposited thin film on the copper surface is stable after the four boiling/cooling cycles. Finally, the underlying mechanism behind the improvements achieved by use of coated surface is studied.

中文翻译：

在铜表面上等离子沉积稳定的SiOx样层，以增强熔池沸腾传热性能：微观结构和润湿性能的结合

在这项研究中，由无机SiO _x组成的薄膜通过大气压等离子体增强化学气相沉积法沉积在铜表面上。进行池沸腾实验，并检查涂层对池沸腾性能的影响。使用扫描电子显微镜，能量色散X射线光谱仪和接触角测量来评估薄膜的形貌，组成和润湿性。除了提高熔池沸腾热特性，尤其是提高传热系数103％之外，还发现在四个沸腾/冷却循环后，铜表面上的等离子沉积薄膜是稳定的。最后，研究了通过使用涂层表面实现改进的潜在机理。

更新日期：2021-01-04

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