Precise printed circuit boards (PCBs) and touch screen panels (TSPs) are produced by the proximity exposure patterning process. In the exposure patterning process, the smaller the gap between the mask and the substrate—under the condition that the mask and the substrate are not in contact—the higher the resolution of the pattern obtained. Unlike a substrate that is fixed on a rigid frame, in the exposure patterning process, only the edges of the mask are fixed, and therefore the center portion of the mask sags under its own weight (in a middle-sized mask, the self-weight deflection of the center portion is approximately 150 µm to 200 µm). Thus, the gap between the mask and the substrate is not constant, and as a result, the resolution of the pattern at the outer part of the mask is degraded. To compensate for this degradation in resolution, during this study, the table on which the substrate was fixed was deformed according to the sagging shape of the mask. The table deformation was performed using two methods. One method used employed an array of electromagnets that were installed under the ferromagnetic table on which the substrate was fixed. Another method used involved an array of actuator modules that directly deformed the duralumin table on which the substrate was fixed. Simulations and experiments were performed to validate this approach.

精确的印刷电路板（PCB）和触摸屏面板（TSP）通过接近曝光图案化工艺生产。在曝光图案化工艺中，在掩模与基板不接触的条件下，掩模与基板之间的间隙越小，所获得的图案的分辨率越高。与固定在刚性框架上的基板不同，在曝光构图过程中，仅掩模的边缘是固定的，因此，掩模的中心部分在自重的作用下会下垂（在中等尺寸的掩模中，中心部分的重量挠度约为150μm至200μm。因此，掩模和基板之间的间隙不是恒定的，结果，掩模的外部的图案的分辨率降低。为了弥补分辨率的下降，在这项研究中，固定基板的工作台根据掩模的下垂形状而变形。工作台变形使用两种方法进行。一种使用的方法是将电磁体阵列安装在固定有基板的铁磁台下面。使用的另一种方法涉及一系列致动器模块，这些致动器模块直接使固定有基板的硬脑膜台变形。进行仿真和实验以验证该方法。使用的另一种方法涉及一系列致动器模块，这些致动器模块直接使固定有基板的硬脑膜台变形。进行仿真和实验以验证该方法。使用的另一种方法涉及一系列致动器模块，这些致动器模块直接使固定有基板的硬脑膜台变形。进行仿真和实验以验证该方法。