Dislocation dynamics simulations were used to calculate the energy barrier of cross-slip via Friedel–Escaig mechanism in face centered-cubic copper. The energy barrier in the unstressed case was found to be 1.9 eV, as reported by Ramírez et al. (2012). The energy barrier was reduced by applying an external stress. The most effective way of reducing it, was by applying a compressive stress on the glide plane. Furthermore, it was confirmed using dislocation dynamics simulations, that both the Schmid and Escaig stress have a comparable effect in reducing the energy barrier, in qualitative agreement with the atomistic simulations performed by Kang et al. (2014) in face-centered cubic nickel. Most of the energy barrier values for stressed cross-slip fell within the experimental error of 1.15 ± 0.37 eV measured by Bonneville et al. (1988). Moreover, the activation enthalpy obtained from the line tension model of Kang et al. (2014) and the general expression for the activation enthalpy proposed by Malka-Markovitz and Mordehai (2019) were in good quantitative agreement with the simulation results. Hence, both could be used to calculate the activation enthalpy of screw segments in dislocation dynamics simulations.

位错动力学模拟用于通过面心立方铜中的Friedel–Escaig机理计算交叉滑动的能垒。据拉米雷斯（Ramírez）等人的报道，在无应力情况下的能垒为1.9 eV。（2012）。通过施加外部应力降低了能垒。减少它的最有效方法是在滑行平面上施加压缩应力。此外，使用位错动力学仿真已证实，施密特应力和埃斯凯格应力在减小能垒方面具有可比的作用，与Kang等人进行的原子学仿真在质量上吻合。（2014）在面心立方镍中。Bonneville等人测得的应力横移的大多数能垒值均在1.15±0.37 eV的实验误差范围内。（1988）。此外，从Kang等人的线张力模型获得的活化焓。（2014）和Malka-Markovitz和Mordehai（2019）提出的活化焓的一般表达式与模拟结果在定量方面吻合良好。因此，在位错动力学模拟中，两者均可用于计算螺杆节段的活化焓。