Targeted at improving microfluidic cooling for the use of micro heat sink in electronic chips, a novel fin-shaped pin-fin array heat sink is proposed. In this study, the mechanism of flow and heat transfer, the arrangements of pin-fin layout, the characteristics of single-phase flow and heat transfer among the micro cylinder pin-fin heat sink, micro fin-shaped pin-fin heat sink of A、B、C types are investigated. It’s showed that stagger micro fin-shaped A pin-fin (SMFAP) exhibits the best hydro-thermal performance. At high Reynolds number, the average Nusselt number of SMFAP reaches up to two times of the in-line micro cylinder pin-fin (IMCP). Moreover, the structure of fin-shaped pin-fin can enhance heat transfer by increasing Nu, while weaken heat transfer by large pressure drop. Therefore, the non-dimensional parameter PEC is adopted to evaluate the heat transfer performance of heat sink. When Re is 800, the PEC of SMFAP reaches to its maximum value of 1.4. SMFAP can effectively enhance heat transfer, while stagger micro fin-shaped B pin-fin(SMFBP) and stagger micro fin-shaped C pin-fin (SMFCP) are not obviously. It’s concluded that different structures of fin-shaped pin-fin will affect the separation point of flow, thus affecting the size of vortex behind the cylinder.

针对改进微流体冷却以在电子芯片中使用微散热器，提出了一种新颖的鳍形销-鳍阵列散热器。本文研究了微型圆柱销翅片散热器，微型翅片状翅片散热器之间的流动和传热机理，针翅式布局的安排，单相流动和传热的特性。研究了A，B，C类型。结果表明，交错的微鳍形A型针鳍（SMFAP）表现出最佳的水热性能。在高雷诺数下，SMFAP的平均努塞尔数达到在线微型圆柱销（IMCP）的两倍。此外，鳍状销鳍的结构可以通过增加Nu来增强热传递，同时通过大的压降来削弱传热。因此，采用无量纲参数PEC来评估散热器的传热性能。当Re为800时，SMFAP的PEC达到最大值1.4。SMFAP可以有效地增强传热，而交错的微鳍状B形鳍状鳍（SMFBP）和交错的微鳍状C形鳍状鳍（SMFCP）则不明显。结论是，翅片形针形翅片的不同结构会影响流的分离点，从而影响圆柱后面的涡流尺寸。