The influence of thermal cycle stress loading on hybrid bonding, which was formed by sintering a mixture of Cu nanoparticles and a eutectic Bi-Sn solder powder, has been investigated. A Si chip and a directly bonded aluminum (DBA) substrate were bonded using the hybrid bonding layer. The bonded sample was evaluated using a thermal cycle test (− 40°C and 250°C). The degradation process of the sample during the test was observed nondestructively using synchrotron radiation x-ray computed laminography. The thermal cycle stress loading had a minimal effect on the microstructure of the bonding layer, which has a high bonding strength owing to the liquid phase sintering and high decomposition melting temperature of the Cu-Sn compound formation. This property reduced the Al deformation of the DBA substrate caused by the thermal cycle loading, resulting in the suppression of the bonding layer degradation. Therefore, hybrid bonding can be instrumental in achieving the reliable operation of power modules at high temperatures.

研究了热循环应力负荷对混合键合的影响，混合键合是通过烧结铜纳米颗粒和低共熔Bi-Sn焊料粉的混合物而形成的。使用混合接合层接合Si芯片和直接接合的铝（DBA）衬底。使用热循环测试（− 40°C和250°C）评估粘合样品。使用同步辐射X射线计算机X射线照相术可无损地观察样品在测试过程中的降解过程。热循环应力负荷对键合层的微观结构影响最小，由于液相烧结和Cu-Sn化合物形成的高分解熔融温度，键合层具有高键合强度。这种特性减少了由热循环载荷引起的DBA基板的Al变形，从而抑制了粘合层的劣化。因此，混合键合有助于实现高温下功率模块的可靠运行。