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Over 80% power-added-efficiency GaN high-electron-mobility transistors on free-standing GaN substrates
Applied Physics Express ( IF 2.3 ) Pub Date : 2020-12-30 , DOI: 10.35848/1882-0786/abc1cc
Yusuke Kumazaki 1, 2 , Toshihiro Ohki 1, 2 , Junji Kotani 1, 2 , Shiro Ozaki 1, 2 , Yoshitaka Niida 2 , Yuichi Minoura 1, 2 , Masato Nishimori 1 , Naoya Okamoto 1, 2 , Masaru Sato 2 , Norikazu Nakamura 2 , Keiji Watanabe 1, 2
Affiliation  

This paper demonstrates highly efficient GaN high-electron-mobility transistors (HEMTs) on GaN substrates with reduced interface contamination. By applying a hydrofluoric acid-based pre-growth treatment to a GaN substrate, the Si impurity concentration at the interface between the GaN substrate and the epitaxial layer can successfully be reduced. RF performance was enhanced by pre-growth treatment owing to the suppression of Si-induced parasitic loss. As a result, GaN HEMTs on GaN substrates exhibited an excellent power-added efficiency of 82.8% at a 2.45GHz. To the best of our knowledge, this exceeds that of the previously reported discrete GaN HEMTs at around this frequency range.



中文翻译:

独立GaN衬底上超过80%的功率增加效率GaN高电子迁移率晶体管

本文演示了在GaN衬底上具有减少的界面污染的高效GaN高电子迁移率晶体管(HEMT)。通过对GaN衬底进行基于氢氟酸的预生长处理,可以成功地降低GaN衬底与外延层之间的界面处的Si杂质浓度。由于抑制了硅引起的寄生损耗,预生长处理提高了射频性能。结果,GaN衬底上的GaN HEMT在2.45 GHz频率下具有82.8%的出色功率附加效率。据我们所知,在该频率范围附近,这已经超过了先前报道的分立式GaN HEMT。

更新日期:2020-12-30
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