Engineers from Fraunhofer IAPT used topology optimization and additive manufacturing to design a heat sink, a common component in many electronic devices. The topology-optimized design was then transformed into a simulation application to automate and customize certain design tasks. Now, engineers, designers, and manufacturers companywide are able to efficiently optimize intricate heat sink geometries and prepare them for 3D printing.

中文翻译：

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设计更好的设备-更快

Fraunhofer IAPT的工程师使用拓扑优化和增材制造来设计散热器，该散热器是许多电子设备中的常见组件。然后将经过拓扑优化的设计转换为仿真应用程序，以自动化和定制某些设计任务。现在，全公司的工程师，设计师和制造商能够有效地优化复杂的散热器几何形状，并为3D打印做准备。