This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the $D$ -band (110–170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.

中文翻译：

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使用 EBG 结构的紧凑型低损耗芯片到波导和芯片到芯片封装概念

这封信提出了一种封装毫米波 (mmW) 和太赫兹 (THz) 电路的新方法。所提出的技术依赖于使用片上耦合结构，该结构将信号耦合到四分之一波长腔，后者又耦合到波导 (WG) 或另一个芯片。该解决方案还使用周期性电磁带隙 (EBG) 结构来控制电磁波并防止在不希望的方向上发生场泄漏。所提出的解决方案是在 $D$ 频段 (110–170 GHz) 上制造和演示的，测量结果表明，它实现了 0.8 的最小插入损耗和从 124 到 161 GHz 的 3 dB 带宽。所提出的方法不需要任何电流接触，可用于封装 WG 模块中的集成电路以及芯片到芯片的通信。