Electromagnetic coupling between planar devices can degrade microwave calibrations and, consequently, the accuracy of a measurement. This letter describes measurement-based methods that can identify, assess, and visualize the electric field coupled between the adjacent planar calibration structures. The coupling within a printed circuit board (PCB)-based and an on-wafer impedance standard substrate is successfully demonstrated and analyzed up to 4 and 20 GHz, respectively, through S-parameter and electric-field measurements obtained using an electrooptic probing system.

中文翻译：

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用于评估校准套件设计质量的电光测量

平面设备之间的电磁耦合会降低微波校准，从而降低测量精度。这封信描述了基于测量的方法，可以识别、评估和可视化相邻平面校准结构之间耦合的电场。通过使用电光探测系统获得的 S 参数和电场测量，成功演示和分析了基于印刷电路板 (PCB) 和晶圆上阻抗标准基板内的耦合，频率分别高达 4 GHz 和 20 GHz。