This research paper presents a novel circuit modeling and analysis of ternary logic for MWCNT bundle interconnects with active shielding under the influence of temperature variations. The far end crosstalk-induced noise and propagation delay of MWCNT bundle interconnects has been analyzed with and without the effect of shielding. A standard ternary inverter (STI) driver model is used to obtain the ternary logic at output. The temperature-dependent analysis is also carried out at different temperatures such as 300, 400 and 500 K. The temperature-dependent comparative analysis for MWCNT bundle, SWCNT bundle and copper interconnects with and without shielding is also performed. It has been observed that MWCNT bundle with active shielding outperforms the SWCNT and Cu by 75.7% and 84.4%, respectively. Similarly, the power dissipation is substantially reduced in the case of MWCNT bundle with respect to the Cu and SWCNT interconnects. It is also reported that the noise margin is marginally stable in ternary interconnects under the influence of temperature variation.

本研究论文提出了一种新颖的电路建模和三元逻辑分析，用于在温度变化的影响下具有主动屏蔽的 MWCNT 束互连。在有和没有屏蔽作用的情况下，对多壁碳纳米管束互连的远端串扰引起的噪声和传播延迟进行了分析。标准三元反相器 (STI) 驱动器模型用于在输出端获得三元逻辑。还在 300、400 和 500 K 等不同温度下进行温度相关分析。还对 MWCNT 束、SWCNT 束和带屏蔽和不带屏蔽的铜互连进行了温度依赖性比较分析。据观察，具有主动屏蔽的 MWCNT 束的性能分别优于 SWCNT 和 Cu 75.7% 和 84.4%。相似地，相对于 Cu 和 SWCNT 互连，在 MWCNT 束的情况下，功耗大大降低。另据报道，在温度变化的影响下，三元互连中的噪声容限略微稳定。