ABSTRACT

As through silicon via (TSV) in three-dimensional (3-D) stacked integrated circuit (IC) has become micro-nanosized, the conventional wafer probe technology cannot fulfil the current detection requirements, so new testing techniques are urgently needed. In this paper, we present amethod for TSV contactless testing based on group delay. The group delay-based mixed testing stimulus is applied to the pending testing TSV through acontactless probe, and then output response is obtained by adetector. The crest factor (CF) is measured and calculated, and fault diagnosis is performed according to the CF difference between faultless and faulty TSV. The void fault of the signal-ground-TSV (SG-TSV) is also detected by the contactless testing method, and its fault function is obtained. The result shows that aresistive open circuit fault as small as several ohms can be detected through this approach. Finally, the fault testing resolution is improved by adjusting the modulation mode of the multi-tone signal.

摘要

由于三维（3-D）堆叠集成电路（IC）中的硅通孔（TSV）已成为微纳米尺寸，传统的晶圆探针技术无法满足当前的检测要求，因此迫切需要新的测试技术。在本文中，我们提出了一种基于群延迟的 TSV 非接触式测试方法。基于群延迟的混合测试激励通过非接触式探针施加到待测试TSV，然后由检测器获得输出响应。测量和计算波峰因数（CF），并根据无故障和有故障的 TSV 之间的 CF 差异进行故障诊断。信号接地TSV（SG-TSV）的空洞故障也采用非接触式测试方法进行检测，得到其故障函数。结果表明，通过这种方法可以检测到小到几欧姆的阻性开路故障。最后，通过调整多音信号的调制方式，提高故障测试分辨率。