Silicone-based UV curing has recently been developed as a novel kind of encapsulation technology, which is time-saving and cost-effective for the package of light-emitting diodes (LEDs). In this work, to improve the light output power (LOP) and device reliability of LEDs packaged by UV curing, Al ₂ O ₃ nanoparticles (NPs) are doped into silicone. Different compositions of Al ₂ O ₃ NPs are used and the optimal composition is found to be 0.3%. Compared with LEDs packaged by UV curing without Al ₂ O ₃ doping (256.3 mW) and by traditional thermal-curing (264.1 mW) encapsulants, the LOP is increased to 272.9 mW for LED with Al ₂ O ₃ -NP-doped encapsulant. The enhancement of LOP is attributed to both the increased refractive index and light scattering effect of the Al ₂ O ₃ NPs, which improves the light extraction efficiency (LEE) of the encapsulant. Furthermore, the improvement of LEE also suppresses the heat generation and thus improving the long-term reliability of the devices. These results indicate that using high refractive index materials as doping, UV curing could be an excellent choice as a novel package technology for the LED industry.

中文翻译：

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Al ₂ O ₃掺杂的紫外固化密封剂改善了基于氮化物的发光二极管的光提取

最近，基于有机硅的UV固化已被开发为一种新颖的封装技术，该技术对于封装发光二极管（LED）既省时又经济。在这项工作中，为了提高通过UV固化封装的LED的光输出功率（LOP）和设备可靠性，将Al ₂ O ₃纳米颗粒（NPs）掺入了硅树脂中。使用不同组成的Al ₂ O ₃ NP，发现最佳组成为0.3％。与通过不掺杂Al ₂ O ₃的UV固化 （256.3 mW）和通过传统热​​固化（264.1 mW）密封剂封装的LED相比，使用Al ₂ O _3的LED的LOP增加到272.9 mW -NP掺杂的密封剂。LOP的提高归因于Al ₂ O ₃ NPs的增加的折射率和光散射效果 ，这提高了密封剂的光提取效率（LEE）。此外，LEE的改进还抑制了热量的产生，从而提高了设备​​的长期可靠性。这些结果表明，使用高折射率材料作为掺杂剂，UV固化可以作为LED工业的新型封装技术的绝佳选择。