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Improved Light Extraction of Nitride-Based Light-Emitting Diodes by Al2O3-Doped UV-Curing Encapsulant
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2020-11-16 , DOI: 10.1109/tcpmt.2020.3038113
Bing Yan , Tianyu Hu , Tao Wang , Zimin Chen , Gang Wang

Silicone-based UV curing has recently been developed as a novel kind of encapsulation technology, which is time-saving and cost-effective for the package of light-emitting diodes (LEDs). In this work, to improve the light output power (LOP) and device reliability of LEDs packaged by UV curing, Al 2 O 3 nanoparticles (NPs) are doped into silicone. Different compositions of Al 2 O 3 NPs are used and the optimal composition is found to be 0.3%. Compared with LEDs packaged by UV curing without Al 2 O 3 doping (256.3 mW) and by traditional thermal-curing (264.1 mW) encapsulants, the LOP is increased to 272.9 mW for LED with Al 2 O 3 -NP-doped encapsulant. The enhancement of LOP is attributed to both the increased refractive index and light scattering effect of the Al 2 O 3 NPs, which improves the light extraction efficiency (LEE) of the encapsulant. Furthermore, the improvement of LEE also suppresses the heat generation and thus improving the long-term reliability of the devices. These results indicate that using high refractive index materials as doping, UV curing could be an excellent choice as a novel package technology for the LED industry.

中文翻译:

Al 2 O 3掺杂的紫外固化密封剂改善了基于氮化物的发光二极管的光提取

最近,基于有机硅的UV固化已被开发为一种新颖的封装技术,该技术对于封装发光二极管(LED)既省时又经济。在这项工作中,为了提高通过UV固化封装的LED的光输出功率(LOP)和设备可靠性,将Al 2 O 3纳米颗粒(NPs)掺入了硅树脂中。使用不同组成的Al 2 O 3 NP,发现最佳组成为0.3%。与通过不掺杂Al 2 O 3的UV固化 (256.3 mW)和通过传统热​​固化(264.1 mW)密封剂封装的LED相比,使用Al 2 O 3的LED的LOP增加到272.9 mW -NP掺杂的密封剂。LOP的提高归因于Al 2 O 3 NPs的增加的折射率和光散射效果 ,这提高了密封剂的光提取效率(LEE)。此外,LEE的改进还抑制了热量的产生,从而提高了设备​​的长期可靠性。这些结果表明,使用高折射率材料作为掺杂剂,UV固化可以作为LED工业的新型封装技术的绝佳选择。
更新日期:2020-12-25
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