We have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.

中文翻译：

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气密封装的气体侵入数学


我们从理想气体的第一原理推导出气体的入口和出口方程。这项工作旨在使密封微电子封装界受益，但它也可能应用于需要深入了解气体进出动态的其他领域。本文概述的方程涵盖封装材料特性、封装特性、气密测试条件和使用条件。它是计算由于气体进出而引起的封装压力变化的实用工具，因此也是预测组件和系统使用寿命的电动工具。