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Back-End-of-Line-Based Resistive RAM in 0.13 渭 m Partially-Depleted Silicon-on-Insulator Process for Highly Reliable Irradiation- Resistant Application
IEEE Electron Device Letters ( IF 4.1 ) Pub Date : 2020-11-10 , DOI: 10.1109/led.2020.3037072
Xu Zheng , Jing Liu , Danian Dong , Zhaoan Yu , Jiayou Song , Juin J. Liou , Xiaoxin Xu , Xiaonan Yang

We demonstrated a resistive random access memory (RRAM) based embedded non-volatile memory (e-NVM) solution integrated in the 0.13 μm partially depleted silicon on insulator (PD-SOI) process. The memory devices show excellent reliability. It has good endurance up to 5 electrical cycles without any degradation in low resistance state (LRS) and high resistance state (HRS). It can retain the data up to 5 s even at 125 °C. Both the LRS and HRS show little variation. After γ-ray radiation with various total ionizing doses (TIDs), the memory characteristics of the device including resistance states, set/reset voltages are not significantly degraded, suggesting good anti-radiation capability. The proposed 1T1R device integrated in SOI process provides a potential candidate for those applications in radiation environments.

中文翻译:


采用 0.13 µm 部分耗尽绝缘体上硅工艺的基于后端的电阻 RAM,可实现高度可靠的抗辐照应用



我们展示了基于电阻式随机存取存储器 (RRAM) 的嵌入式非易失性存储器 (e-NVM) 解决方案,该解决方案集成在 0.13 μm 部分耗尽绝缘体上硅 (PD-SOI) 工艺中。该存储器件表现出出色的可靠性。它具有高达 5 个电周期的良好耐久性,在低电阻状态 (LRS) 和高电阻状态 (HRS) 下不会出现任何退化。即使在 125 °C 下,它也能保留数据长达 5 秒。 LRS 和 HRS 几乎没有变化。经过不同总电离剂量(TID)的γ射线辐射后,器件的电阻状态、置位/复位电压等存储特性没有明显下降,表明器件具有良好的抗辐射能力。所提出的集成在 SOI 工艺中的 1T1R 器件为辐射环境中的应用提供了潜在的候选者。
更新日期:2020-11-10
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