The buckling deformation of a serpentine interconnect on a flexible electronic composite film is analyzed by a scanning electron microscope miniature tensile stage in situ observation workstation. The buckle formed at the junction of the interconnect pattern under a tensile load is observed. Combined with the buckle size and a theoretical model, the interface adhesion energy and shear stress are derived. The relationship between thickness of the interconnect Cu layer and interface performance is further analyzed. Results show that within the thickness range of 25–500nm, a 75nm thick serpentine interconnect has the best adhesion performance on a flexible substrate (about 10.09 J m^–2).

通过扫描电子显微镜微型拉伸台原位观察工作站分析柔性电子复合薄膜上蛇形互连件的屈曲变形。观察在拉伸载荷下在互连图案的接合处形成的弯曲。结合扣环尺寸和理论模型，推导出界面粘附能和剪切应力。进一步分析了互连Cu层的厚度与界面性能之间的关系。结果表明，在 25-500nm 的厚度范围内，75nm 厚的蛇形互连在柔性基板上的粘附性能最好（约 10.09 J m ^–2）。