This research studied the comprehensive dielectric properties of copper (Cu)/polyethylene terephthalate (PET) and copper/polytetrafluoroethylene (PTFE) composite films under the influence of copper nanoparticle (CuNP) sputtering time. Copper thin film was grown on flexible PET and PTFE using the ion beam sputtering technique. X-ray diffraction confirmed that CuNPs had been successfully synthesized on the polymer substrate. The electrical conductivity σ _AC of the films was measured using alternating-current conductivity impedance in the frequency range of 10²–10⁶ Hz. It increased from 1.2 × 10⁻⁶ S/cm for PET to 9.65 × 10⁻⁷ S/cm for 75 min copper/PET and from 6.38 × 10⁻⁷ S/cm for PTFE to 9.24 × 10⁻⁷ S/cm for 75 min copper/PTFE. The dielectric constant ε′ increased from 0.62 for pristine PET to 1.19 for 25 min copper/PET and from 1.88 for pristine PTFE to 2.25 for 25 min copper/PTFE at an applied frequency of 10⁵ Hz. In addition, other parameters – namely, dielectric loss ε″, dielectric modulus m and dielectric tangent constant tan δ – were investigated. The comprehensive results showed that the dielectric properties of flexible PET and PTFE polymers improved due to the deposited conductive CuNPs. Flexible copper/PET and copper/PTFE composite films are promising as dielectric substrates for modern electronic applications that can resist hard environments and have long lifetimes.

中文翻译：

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柔性铜/聚合物纳米复合膜的增强介电性能

这项研究研究了铜（Cu）/聚对苯二甲酸乙二酯（PET）和铜/聚四氟乙烯（PTFE）复合膜在铜纳米粒子（CuNP）溅射时间的影响下的综合介电性能。使用离子束溅射技术在柔性PET和PTFE上生长铜薄膜。X射线衍射证实，CuNP已经成功地在聚合物基底上合成。电导率σ _AC 10的频率范围内使用交流电导率阻抗测定膜的² -10 ⁶ 赫兹。它从 PET的1.2×10 ^-6 S / cm增加到 75分钟的铜/ PET的9.65×10 ^-7 S / cm和从6.38×10 ^-7 PTFE的 S / cm为75分钟铜/ PTFE的9.24×10 ^-7 S / cm。在10 ⁵  Hz的施加频率下，介电常数ε '从原始PET的0.62增长到25分钟铜/ PET的1.19，从原始PTFE的1.88增长到25 / min铜/ PTFE的2.25，在施加频率10 ⁵ Hz时。此外，其它参数-即，介电损耗ε “，电介质模数米和介电正切恒定黄褐色 δ–被调查。综合结果表明，由于沉积的导电CuNPs，柔性PET和PTFE聚合物的介电性能得到改善。柔性铜/ PET和铜/ PTFE复合膜有望作为现代电子应用的介电基材，可以抵抗恶劣的环境并具有较长的使用寿命。