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Ag Nanoparticles Sheltered In2O3 Nanowire as a Capacitive MOS Memory Device
IEEE Transactions on Nanotechnology ( IF 2.1 ) Pub Date : 2020-01-01 , DOI: 10.1109/tnano.2020.3035179
Amitabha Nath , Bikram Kishore Mahajan , Mitra Barun Sarkar

A capacitive memory effect has been reported for Ag nanoparticles (NPs) sheltered In2O3 nanowires (NWs) devices. To compare the performance with that of bare In2O3 NWs, two devices (viz. In2O3 NW/Ag NPs and In2O3 NW) were fabricated on n-Si substrate inside the electron beam (e-beam) evaporator using the double-step glancing angle deposition (GLAD) technique. The field emission scanning electron microscopy (FESEM) shows the formation of In2O3 NWs and Ag NPs. The high-resolution transmission electron microscopy (HRTEM) shows the formation of uneven NWs and selected area electron diffraction (SAED) analysis confirmed the amorphous nature of the NWs. An averagely ∼7.5 and ∼9.3 fold enhanced absorption was observed in the UV region and visible region for In2O3 NW/Ag NPs. The modulation in current density of ∼4.5 fold at +10 V and ∼5.7 fold at −10 V were observed for the fabricated In2O3 NW/Ag NPs MOS device. At 2 MHz frequency response, the In2O3 NW/Ag NPs device depicted a low interface trap density (Dit) of ∼0.2 × 1010 cm−2 eV−1. The maximum memory window of 5.61 V at ±8 V was extracted for the In2O3 NW/Ag NPs device from the large C-V hysteresis curve, thus establishing a strong presence of memory window in the device.

中文翻译:

银纳米颗粒保护 In2O3 纳米线作为电容性 MOS 存储器件

已经报道了用于掩蔽在2 O 3纳米线 (NW) 器件中的Ag 纳米粒子 (NP) 的电容记忆效应。为了将性能与裸 In 2 O 3 NW的性能进行比较,在电子束(电子束)内的 n-Si 衬底上制造了两种器件(即 In 2 O 3 NW/Ag NP 和 In 2 O 3 NW)蒸发器采用双步掠射角沉积 (GLAD) 技术。场发射扫描电子显微镜 (FESEM) 显示 In 2 O 3的形成NW 和 Ag NP。高分辨率透射电子显微镜 (HRTEM) 显示不均匀 NW 的形成,选区电子衍射 (SAED) 分析证实了 NW 的无定形性质。In 2 O 3 NW/Ag NPs在紫外区和可见光区的吸收平均提高了约 7.5 倍和约 9.3 倍。对于制造的 In 2 O 3 NW/Ag NPs MOS 器件,观察到电流密度调制在 +10 V 时为~4.5 倍,在 -10 V 时为~5.7 倍。在 2 MHz 频率响应下,In 2 O 3 NW/Ag NPs 器件显示出低界面陷阱密度(Dit ) ~0.2 × 10 10  cm -2 eV -1。从大 CV 滞后曲线中提取 In 2 O 3 NW/Ag NPs 器件在 ±8 V 时的最大内存窗口为 5.61 V ,从而在器件中建立了强大的内存窗口。
更新日期:2020-01-01
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