A mixed‐valent, one‐dimensional Cu(I/II) coordination polymer with the formula [Cu^II{Cu^I₃(Hmpba)(mpba)₂}DMF] ⋅ ∼3DMF was obtained with the bifunctional ligand 4‐(3,5‐dimethyl‐1H‐pyrazol‐4‐yl)benzoic acid (H₂mpba) in N,N‐dimethylformamide (DMF) via solvothermal reaction. The compound exhibits a trinuclear {Cu^I₃(Hmpba)(mpba)₂}²⁻ metallo‐linker with the softer Cu(I) linearly‐coordinated by the softer pyrazolate nitrogen donor atom. This metallo‐linker connects the harder Cu(II) ions through its harder carboxylate groups into a chain structure. Two Cu(II) ions form a paddlewheel unit and are, thus, surrounded by four carboxylate groups. Cu(II) is five‐coordinated with a terminal DMF ligand. Parallel chains are connected into supramolecular layers through the common R₂²(8) hydrogen‐bond motif of the singly‐deprotonated carboxyl groups of the Hmpba ligand. These layers are further organized by Cu(I)−Cu(I) interactions into a 3D supramolecular array.

中文翻译：

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带有双功能软硬吡唑酸酯-羧酸酯配体的混合价铜（I / II）配位聚合物

的混合价的，一维与所述化学式为Cu（I / II）的配位聚合物[铜^II {铜^我₃（Hmpba）（MPBA）₂ } DMF]⋅~3DMF用双官能配体4-（3获得通过溶剂热反应在N，N-二甲基甲酰胺（DMF）中形成5-2-二甲基-1 H-吡唑-4-基）苯甲酸（H ₂ mpba）。该化合物具有三核{Cu ^I ₃（Hmpba）（mpba）₂ } ^2-金属键与较软的Cu（I）线性地由较软的吡唑酸酯氮供体原子配位。该金属连接剂通过其较硬的羧酸盐基团将较硬的Cu（II）离子连接成链结构。两个Cu（II）离子形成一个桨轮单元，因此被四个羧酸酯基团包围。Cu（II）与末端DMF配体五配位。平行链通过Hmpba配体的单去质子化羧基的常见R ₂ ²（8）氢键基序连接到超分子层。这些层通过Cu（I）-Cu（I）相互作用进一步组织成3D超分子阵列。