This study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L⁻¹ sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L⁻¹ with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.

这项研究提出了一种优化的浸出和电解沉积工艺，用于从废印刷电路板中回收铜，包括化学消耗量和渗滤液再循环的研究。在稀硫酸和过氧化氢介质中，使用响应面方法对浸出进行了优化。通过使用3.6 mol L ^-1硫酸，6％体积百分比的过氧化氢，纸浆密度为75 g L ^-1来找到最佳的铜浸出条件在20°C下具有186分钟的浸出时间，导致铜的完全浸出，然后电沉积中的回收率超过92％，纯度达到99.9％。化学消耗量的研究表明，浸出过程中过氧化氢会完全分解，而硫酸浓度的变化很小。在最多5个循环的渗滤液再循环过程中，铜的回收率和产品纯度保持较高水平，而酸消耗降低了60％。