Abstract

The effect of a hybrid filler on the thermal conductivity of an epoxy composite is described. The hybrid filler, containing boron nitride (BN) particles and silicon nitride (Si₃N₄) whiskers with different wt% ratios (20:0, 18:2, 15:5, 10:10, 5:15, 2:18 and 0:20), was loaded into the epoxy resin. The thermal conductivities of the doped composites were higher than that of the pure EP (0.4287 W·m⁻¹·K⁻¹); with addition of BN and Si₃N₄ fillers the 10%BN/10%Si₃N₄/EP composites exhibited the highest thermal conductivity (1.1486 W·m⁻¹·K⁻¹), which was 185% and 214% that of the 20%BN/EP composite (0.6200 W·m⁻¹·K⁻¹) and the 20%Si₃N₄/EP (0.5374 W·m⁻¹·K⁻¹), respectively. The impact strength of the composite material 10%BN/10%Si₃N₄/EP also was the maximum (3.48 KJ/m²). Thus, the 10%BN/10%Si₃N₄/EP composites not only exhibited excellent thermal conductivity, but also slight improvements in thermal stability and impact strength. Suggesting it would be useful for thermal sensor interconnections of electronic circuits.

摘要

描述了混合填料对环氧树脂复合材料热导率的影响。混合填料，含有不同重量百分比（20:0、18:2、15:5、10:10、5:15、2:18 ）的氮化硼（BN）颗粒和氮化硅（Si ₃ N ₄）晶须和 0:20), 被加载到环氧树脂中。掺杂复合材料的热导率高于纯EP（0.4287 W·m ^-1 ·K ^-1）；添加BN和Si ₃ N ₄填料后，10%BN/10%Si ₃ N ₄ /EP复合材料表现出最高的热导率（1.1486 W·m ^-1 ·K ^-1)，分别是 20%BN/EP 复合材料 (0.6200 W·m ^-1 ·K ^-1 ) 和 20%Si ₃ N ₄ /EP (0.5374 W·m ^-1 ·K ^- ) 的 185% 和 214% ¹ )，分别。复合材料10%BN/10%Si ₃ N ₄ /EP的冲击强度也最大(3.48 KJ/m ² )。因此，10%BN/10%Si ₃ N ₄ /EP 复合材料不仅表现出优异的导热性，而且在热稳定性和冲击强度方面也略有提高。建议它对电子电路的热传感器互连很有用。