With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

中文翻译：

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锡基无铅复合钎料合金组织和性能演变的研究现状

随着焊点的小型化和使用环境的恶化，人们已经进行了很多努力来改善Sn基无铅焊料的性能。纳米粒子的添加制备锡基无铅复合焊料合金是提高性能的有效途径之一。本文通过总结代表性的Sn-Ag-Cu（SAC），Sn-Bi和其他多元素无铅复合材料的相关研究成果，综述了Sn基无铅复合焊料合金的最新研究进展。焊料合金。具体而言，总结了添加的纳米颗粒对Sn基无铅复合焊料合金的润湿性，微观结构形态和机械性能演变的影响。希望本文能为开发新型的Sn基无铅复合焊料合金提供有益的建议。此外，提出了开发新型新型锡基无铅复合焊料合金的问题和未来的发展趋势。