Abstract Insulating materials with effective electromagnetic interference (EMI) shielding and heat dissipation are urgently required for modern electronic devices and systems, but it seems that the EMI shielding cannot be compensated without sacrificing the electrical insulation performance. In this study, a layer-by-layer spin coating process has been proposed to prepare multilayer films (MXene/polydimethylsiloxane/boron nitride, MXene/PDMS/BN) with ordered alternate structures, and the EMI shielding effectiveness (EMI SE), thermal conductivity, along with electrical insulation properties of multilayer films have been systematically investigated. The conductive network of MXene/PDMS layer was in-plane constructed, leading to the effective EMI shielding of the multilayer films. Moreover, the BN/PDMS layer can insulate the conductive path through plane and provides effective heat dissipation for multilayer films. The EMI SE of multilayer films is positively related to the number of layers, but the increase in the number of layers will deteriorate the thermal conductivity and electrical insulation performance. The EMI SE of the multilayer film with 11-Layers structure can reach 35.2 dB at 10.9 GHz, with a thermal conductivity of 0.65 W/m·K, and volume resistivity of 2.9 × 1012 Ω cm, as well as a breakdown strength of 3.29 KV/mm, respectively. This research can shed new light on the development of multifunctional composite, which can be envisioned as an advanced electronic packaging material.

中文翻译：

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具有增强导热性的电绝缘 MXene/PDMS/BN 复合材料，用于电磁屏蔽应用

摘要 现代电子设备和系统迫切需要具有有效电磁干扰（EMI）屏蔽和散热功能的绝缘材料，但似乎无法在不牺牲电绝缘性能的情况下对EMI屏蔽进行补偿。在这项研究中，提出了一种逐层旋涂工艺来制备具有有序交替结构的多层薄膜（MXene/聚二甲基硅氧烷/氮化硼，MXene/PDMS/BN），以及 EMI 屏蔽效率（EMI SE）、热已经系统地研究了多层薄膜的导电性以及电绝缘性能。MXene/PDMS 层的导电网络在平面内构建，从而对多层薄膜进行有效的 EMI 屏蔽。而且，BN/PDMS 层可以通过平面隔离导电路径，并为多层薄膜提供有效的散热。多层膜的EMI SE与层数呈正相关，但层数的增加会使导热性和电绝缘性能变差。11层结构的多层膜的EMI SE在10.9 GHz时可达35.2 dB，热导率为0.65 W/m·K，体积电阻率为2.9 × 1012 Ω cm，击穿强度为3.29 KV/mm，分别。该研究可为多功能复合材料的开发提供新的思路，该复合材料可被视为一种先进的电子封装材料。但层数的增加会使导热性和电绝缘性能变差。11层结构的多层膜的EMI SE在10.9 GHz时可达35.2 dB，热导率为0.65 W/m·K，体积电阻率为2.9 × 1012 Ω cm，击穿强度为3.29 KV/mm，分别。该研究可为多功能复合材料的开发提供新的思路，该复合材料可被视为一种先进的电子封装材料。但层数的增加会使导热性和电绝缘性能变差。11层结构的多层膜的EMI SE在10.9 GHz时可达35.2 dB，热导率为0.65 W/m·K，体积电阻率为2.9 × 1012 Ω cm，击穿强度为3.29 KV/mm，分别。该研究可为多功能复合材料的开发提供新的思路，该复合材料可被视为一种先进的电子封装材料。分别。该研究可为多功能复合材料的开发提供新的思路，该复合材料可被视为一种先进的电子封装材料。分别。该研究可为多功能复合材料的开发提供新的思路，该复合材料可被视为一种先进的电子封装材料。